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[Series Volume 7] Column written by Naoki Kunimine, Thermal Design Consultant

<Free Offer> From my position, having been involved in thermal design for many years, I would like to share my thoughts on thermal design that I have on a daily basis.

Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column document reflecting on 45 years of involvement in thermal design, titled "A Collection of Thermal Design Stories." Due to the positive feedback from readers, we are distributing the 7th installment of the column. 【Content Summary (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 7th installment, following the 5th and 6th installments, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific countermeasures. ■ Thermal measures for the circuit board are carried out through "heat source dispersion" and "heat diffusion." ■ Heat source dispersion achieves the same effect as "improving the thermal conductivity of the circuit board." ■ Forming a heat dissipation pattern with copper foil to diffuse heat within the circuit board. *For more details, please refer to the PDF document or feel free to contact us.

企業：コスモ石油ルブリカンツ
価格：Other

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Thermal management for printed circuit boards

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[Final Installment] Column Written by Naoki Kunimine, Thermal Design Consultant

<Free Giveaway> From my position of having been involved in thermal design for many years, I would like to share my thoughts on thermal design.

Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the favorable response from readers, we are distributing the 8th installment (final edition) of the column. 【Content Overview (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 8th installment, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific implementation methods for thermal countermeasures that can be applied to the board. ■ There are mainly four thermal countermeasures that can be applied to the board ■ Reduce the thermal resistance between components (heat sources) and the board ■ Increase the thermal diffusion capability of the board itself ■ Enhance heat dissipation from the surface of the board ■ Reduce heat absorption from adjacent components *For more details, please refer to the PDF material or feel free to contact us.